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Principles and processes of 3,4-ethylene dioxythiophene EDOT (126213-50-1) in the SOC process
2014-08-07
来源：亚科官网
SOC is abbreviation of the circuit board organic conductive polymer selective coating process, also known as direct plating, is a new method to replace the traditional circuit board PHT hole metallization plating process.
First, the principle of technology
The basic principle of SOC is under the action of the initiator MnO2 on the insulating resin substrate, 3,4-ethylenedioxythiophene (EDOT) is catalyzed and polymerized to PEDOT, PEDOT as the SOC conductive film, can replace the PTH metallization process, and then through the plating process to complete the metallization of via-hole.
Second, the process description
SOC process, includes the main process of adjustment, trigger, polymerization. The adjustment is to activate the non-conductive substrate to promote the deposition of the initiating section MnO2. The trigger principle is that the insulating resin is oxidized in the acid permanganate solution and the product MnO2 is deposited on the dielectric material in the hole, which acts as a catalyst for the reaction of the polymerisation stage. The principle of polymerization: the monomer is induced to polymerize into the polymer conductive polymer through the catalysis of MnO2. Because permanganate can not react with copper, so the copper surface will not produce initiator, copper surface can not be deposited conductive polymer film. Therefore, the conductive polymer film deposited only in the insulating resin and glass fiber, which has good selectivity. On the one hand, it ensures the conductivity of the insulating layer requirements, on the other hand, it will not have an impact on the bonding strength of the copper surface. In order to confirm its selectivity, we conducted the following tests:
Take two CCLs of the same material, one is etched away from the surface copper and the other is not treated. The two substrates were processed by adjustion-initiation-polymerization, then make the EDX analysis of the surface. Figure 3 shows that the EDX analysis of the copper surface without the characteristic element S of the SOC film, and in the copper-free substrate, there is a characteristic element S of the SOC film. This shows that the organic conductive polymer is not deposited in the copper layer, only deposited on the insulating substrate, which has a better selectivity.
Edited by Suzhou Yacoo Science Co., Ltd.
